ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,969, issued on April 7, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Flexible monomer for smooth polymer surface" was inv... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,970, issued on April 7, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Top via on subtractively etched conductive l... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,971, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Conductive via with improved ga... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,972, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho). "Methods used in forming a memory array comprising strings o... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,973, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho). "Microelectronic devices, and related memory devices, electr... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,974, issued on April 7, was assigned to XINTEC INC. (Taoyuan City, Taiwan). "Chip package and manufacturing method thereof" was invented by... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,975, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Integrated circuit device" was invented by J... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,976, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device" was invented by Jeo... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,977, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Fill of vias in single and dual damascene structures using self... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,978, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a source/drain c... Read More